This application note is focused on printed circuit board pcb layout issues when using llftfbga packages from the nxp lpc. Bga layout while designing your printed circuit board for. Application note pcb design guidelines for bga rework. Bga layout for ease of use presenter mike galloway manufacturing engineer 2. Ipc 7095c design and assembly process implementation for. I was asked by many pcb designers about bga design guidelines, say ball pad size, pitch size, annular ring, layer counts, solder mask opening, etc. Business business, international computers and office automation integrated circuits organic chlorine compounds organochlorine. Bga breakouts and routing advanced electronic technology. Leads normally placed along the periphery of the package are replaced with solder balls. Currently, the standard for housing a variety of advanced and multifaceted semiconductor devices like fpgas and microprocessors is done through ball grid array bga device packaging. See this article on how to layout elongated holes slots. It is, however, quite difficult to try and teach pcb design. The scope of this application note is focused on printed circuit board pcb layout issues when using llftf bga packages from the nxp lpc microcontroller family. Its a good idea for the seasoned pcb designer to perform preliminary experimental layouts and prototype rounds to get the lay of the design before launching into a fullfledged layout.
This means the pcb designer must be on top of hisher game, and certainly not be. An10778 pcb layout guidelines for nxp mcus in bga packages. Allegros powerful design rules and constraint system will also give you the. Bga routing guidelines best practices for via design. Lfbga256, lfbga324, lfbga320, layout guidelines, bga, pcb, fanout abstract this application note is focused on printed circuit board pcb. Having no leads to bend, the pbga has greatly reduced coplanarity problems. For custom designs, use the same number of pcb layers as are present in the reference design whenever possible. I found this bga design tips pdf helpful, it has a pretty no nonsense look at bga design and should give you a few pointers on pcb layout. Pcb basic design rules 102019 multi circuit boards. With several hundred component connections, the number of routable pins is limited per layer. All connections are distributed in a uniform surface grid or matrix on the component. Are you looking for pcb design questions here are some interesting question and answers 1. Useful book for pcb design electrical engineering stack. The purpose of this document is to provide basic component design guidelines for pcbs, subsequent rework and to explain the techniques of reworking bga components using a manual rework system with autoprofiling capability.
An10778 pcb layout guidelines for nxp mcus in bga packages rev. The circuit designers requires smaller designs with high performance and high circuit density whereas the ic fabrication engineer requires high yield process. The schematic is normally the warmup act for the actual layout. Design rules to fanout a large bga pcb design blog altium. Disposal of these rules does not alter any of the restrictions set forth above. Here are what i like to call the 10 golden rules of simple, clean design. Fine pitch bga components involved in a design may decrease product yield negatively if dfm rules are neglected. To facilitate routing in the ball grid area, necking down the trace width in the critical space between the bga padsvias the breakout area is. Bga miniaturization amplifies the design challenge of balancing highperformance signal integrity with fabrication cost reduction. Id start with free layout software like eagle and some good tutorials once youve laid out a couple of pcbs, the first book you linked to high speed digital design is great the best reference on. Ee143 s06 lecture 19 layout design rules 1 absolutevalue design rules use absolute distances 2. Analog and digital circuits should be partitioned on pcb layout the layout of the evaluation board is optimized in terms of grounding, decoupling, and signal routing and can be used as a model when laying out the adc section of the pc board in a system.
The increased io count associated with bga packages has made multilayer pcbs the industrystandard method for performing escape routing. Powerful autorouter streamlines the routing process of dense bga, csp, pcb and hybridmcm designs with cdss exclusive autorouting technology. Board design guidelines for intel programmable device. On the left side of the pcb rules and constraints editor menu, go down to the placement rules and click on the arrow to open up. Its advantages over other high leadcount greater than 208 leads packages are many. Until that time arrives, lets walk through how to run a basic design rule check on our project. Book layout timothy samaras 20 rules of good design on. Finepitchpcb design is a team effort and may require more than a common list of design rules. Pcb and high speed serial interface hssi design guideline. Main objective of design rule is to achieve a high overall yield and reliability using smallest possible silicon area. A test board was designed to reveal manufacturing limits of the departments pwb. Below is an example of ddr2 highspeed design rules for altium designer. But as you dive into more professional projects youll likely set up some custom design rules before you ever place a component or lay down a track.
It would have been easier if the pads that required rerouting were on the. Please also note that these rules are the bare minimum that we support. Open up the design rules by going to the design rules menu selection. Intel stratix 10 devices, high speed signal interface layout design guideline an 875. Recommended layout dimensions within bga area for 1. Investigations on boardlevel reliability within infineon have shown that in. Tips for routing bga packages that wont leave you puzzled. Recommended design rules and strategies for bga devices. This topic will cover why to use bgas and specific considerations to have while designing your pcb.
Once the room has been created, it is time to start working with the design rules. Fabrication, layout and design rules process overview. Just as there are tolerance considerations, placement restrictions and best design practices for components and traces, so too for multilayer routing of. A grid helps define the text box, the image box and the gutter.
With the introduction of bga components, things had to change. Oxiditation is the process of converting silicon to silicon dioxide, which is a durable insulator. The design rules stated above apply to 2layer as well as our 4layer boards. Business business, international computers and office automation circuit design technology application circuit printing printed circuit boards printed circuits.
In this article, i am going to introduce them step by step. Deviation from the reference pcb layer count can cause different pcb parasitic capacitances. Bga layout while designing your printed circuit board 1. Best pcb routing methods for bga escape routing advanced. Recommendations for board assembly of infineon ball grid array packages printed circuit board figure 5 shows an example of a bga solder ball with smd pad design on the component side and with nsmd pad design on the pcb side. Pcb technical advice for pcb design and fabrication tips. By setting up your printed circuit board design for good bga escape routing first. This document will explain methods to correctly route this bga chip on a printed circuit.
This book explores the impact of dense bgas with high pincount on pcb design and provides solutins for inherent design challenges and is for pcb designers. Techniques to improve performancetechniques to improve performance what can we do. They are based loosely on the 10 principles of good design proposed by master product designer dieter rams, but ive modified them a bit to fit with a more general goal of design simplicity. There are manyyy myths and folklore about the art of pcb design old rules of thumb no longer apply time to update our techniques and remove the mystery freescale semiconductor confidential and proprietary information. Pcad pcb users guide i table of contents chapter 1 introduction to pcad pcb pcad pcb features1. Bga packages for embedded design has evolved significantly over the years, to keep up with the technological progression of chip manufacturers. Close coordination and communication between component supplier, pcb designer, pcb fabricator, and pcb.
With todays higher density routing being packed into reduced design schedules, pcb layout engineers need help in speeding up the routing. Reproduction of ti information in ti data books or data sheets is permissible. This is more to share the interesting parts than to hash out schematic requirements. Screaming circuits is excited to offer a presentation on bga layout. Ball grid array bga vias add flexibility to the pcb design process and complexity to the pcb fabrication and assembly process. Slide vias while dragging traces with them and maintain complex, multilevel design rules. Flow of complete pcb design library creation board outline and mechanicals importing netlist design rule settings component placement rounting split plans silkscreen and assembly settings gerber settings 2.
One of the most important parts of the surface mount assembly process is the application of solder paste to the printed circuit board pcb this is generally achieved by the use of a stencil or foil. Everyday low prices and free delivery on eligible orders. For ic manufacturing it has several uses such as selectively masking the chip components against implants or diffusion. As technology increases, so does the need for bga ball grid array components. Fortunately, your pcb design tools can do a lot to help you with your routing of bga packages.
Careful planning goes into routing out of a bga package like this. The amount of space available for routing under the fpga is dependent on the area between the balls in the bga area for top and bottom layers, as we ll as the area between vias for inner layers. Recommended pcb design guidelines for microsemi ccga ceramic column grid array or cg package the recommended guidelines for the 1. They usually specify min allowable line widths for physical object on chip. A total of 23 of the balls on the bga were not connected where they needed to be. Bgas ball grid arrays are smd components with connections on the bottom of the component. Recommendations for board assembly of infineon ball grid. Board design optimization for fine pitch bga components. The design rules is the media between circuit engineer and the ic fabrication engineer. Introduction physical mask layout of any circuit to be manufactured using a particular process must follow a set of rules. Layout design rules are used to translate a circuit concept into an actual geometry in silicon. Eia standard board layout drawing for bga, ccga, csp, and qfn 7 table 5.
No portion of these design rules may be published, reproduced, sold or distributed by any means, or quoted or published in any medium, including on any website, without the prior written consent of battlebots, inc. Book layout timothy samaras 20 rules of good design actual size. As a side point theres issues with heat and mechanical stress affecting the bgas connections, although they dissipate heat well, they hate movement and flex in. Practical electronicspcb layout wikibooks, open books for an. Berkeley 2 ee143 s06 lecture 19 ee143 layout design rules 1. The following are some general rules for designing rfrelated layouts for good rf performance. This book is for pcb designers who are designing boards with multiple. There are many basic rules and good practices to follow, but apart from that pcb design is a highly creative and individual process. The civil aviation authority caa is the uk aviation safety regulator, in which role. This result in a pcb design should be even more cost effective than a 0.
There is no ready answer for it, because every bga is different from one another, yet there are some rules and tips to follow to make better results. Bga layout while designing your printed circuit board. In bga packages, the io connections are located on the interior of the device. On the left side of the pcb rules and constraints editor menu, go down to the placement rules and click on the arrow to open up these rules. These special highspeed design rules should be given top priority in the design rule hierarchy.
My experience learning to lay out pcbs was that books are not helpful at the early stages. Overview introduction bga capability bga history dfm standards technologies design thermal management trace routing and vias 3. Thats a significant redesign under any circumstances. When possible, i normally reduce the tolerance within data lanes 03 to 25 mil in order to get a tighter match, although the jedec spec is 50 mil. The bga is the national governing body of sport gliding. Reproduction of ti information in ti data books or data sheets is. Bga pcb design rules are important, learn more about how to successfully design a bga in your pcb design software by downloading a free white paper. This video shows an example of a complex bga in orcad library builder. Pcb and high speed serial interface hssi design guidelines ap32174 high speed board design application note 7 v1. Routing the signal traces out of the bgas is a process that is generally.
Recommended footprint patterns for the tfbga180, tfbga208, tfbga296, lbga256 and lfbga320 pin packages. If you can leave some safety margins in your design, the pcbs will be more likely to work the way you intended them to. Only two signal layers needed these are the results of the bga escape. As technology continues to grow at a rapid rate, so does the challenge each designer faces, to route their design into very tight spaces. The european aviation safety agency easa is the eu aviation regulator. The omap35x ball grid array is designed with new technology called the via. Eia standard board layout drawing for bga, ccga, csp, and qfn. Gliding takes place under a mix of national, european and self regulation. List of major upgrades, design rules, and exceptions. Layout design for fine pitch components requires customized design rules and appropriate wiring agreeing both electrical and technology demands.